Description
- AMAT 0010-47763 | OEM Refurbished Wafer Chuck Assembly
2. Unboxing & Physical Snapshot
- Model & Brand: AMAT 0010-47763 (Applied Materials)
- Product Type: Electrostatic Chuck (ESC) Assembly
- Application: Semiconductor wafer processing equipment component. The 0010-47763 is identified as an ESC assembly, bonded, monopolar dual heated unit used in Applied Materials wafer fabrication equipment.
- Equipment Function: Provides wafer clamping force through electrostatic attraction while integrating dual-zone heating capability for process temperature control.
- Approximate Physical Dimensions (W × H × D):
- Estimated: 250–350 mm diameter × 40–80 mm height
- Exact dimensions depend on chamber configuration and ESC revision.
- Estimated Shipping Weight: Approximately 3–8 kg including protective clean packaging and shock-resistant transport case.
- What’s in the Box:
- AMAT 0010-47763 ESC assembly
- Bonded ceramic chuck structure
- Electrical connection interface
- Heater connection terminals (configuration dependent)
- Protective cleanroom packaging
- Traceability label and inspection record when supplied
3. Product Introduction
The AMAT 0010-47763 is a critical chamber hardware component designed for wafer positioning and thermal control inside semiconductor process equipment. The electrostatic chuck applies controlled holding force without mechanical clamps, allowing precise wafer placement during plasma or deposition processes. The dual-heated design supports controlled thermal uniformity across the wafer surface (which is critical for repeatable process results).
Handle this assembly like a precision ceramic process component. Do not place the chuck surface directly on metal work surfaces. Inspect the ceramic face, bonding layer, heater connections, and backside mounting features before installation. Small surface damage, particle contamination, or incorrect handling can create yield issues after the tool returns to production.
4. Core Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer | Applied Materials (AMAT) |
| Part Number | 0010-47763 |
| Component Type | Electrostatic Chuck Assembly |
| Description | ESC Assembly, Bonded, Monopolar Dual Heated |
| Application | Semiconductor wafer processing equipment |
| Chuck Type | Monopolar ESC |
| Heating Configuration | Dual heated zones |
| Wafer Clamping Method | Electrostatic attraction |
| Material Construction | Ceramic dielectric chuck assembly |
| Process Interface | Wafer support surface |
| Heater Power | Tool configuration dependent |
| Temperature Control | Dual-zone heater management |
| Electrical Interface | Equipment-specific connectors |
| Processor | None |
| Memory | None |
| Firmware | None |
| Power Consumption | Passive mechanical component with heater load controlled externally |
| Heat Dissipation | Dependent on process temperature settings |
| Mounting Method | Process chamber installation |
| Cleanliness Requirement | Semiconductor cleanroom handling |
AMAT 0010-47763
5. Global Compliance & Industry Certifications
Expected compliance considerations for the AMAT 0010-47763 include:
- CE Mark consideration through the complete Applied Materials process tool certification.
- UL/cUL electrical safety compliance may apply through the equipment-level certification.
- RoHS / REACH documentation may be required for semiconductor manufacturing supply chains.
- IEC equipment safety standards apply through the completed semiconductor processing system.
- ATEX/IECEx is generally not expected for standard fab applications unless the complete process tool is installed in a classified hazardous location.
- Marine approvals such as DNV GL are generally not applicable for semiconductor processing equipment.
For audit purposes, ESC traceability is important because replacement history, material condition, and process compatibility directly affect equipment qualification records.
Verify specific lot certifications with OEM.
6. Long-Term Storage & Asset Preservation Guide
- Store the AMAT 0010-47763 in a clean, sealed protective package. The ceramic wafer-contact surface must remain protected from particles, fingerprints, and mechanical impact.
- Maintain storage humidity below 60% RH. Moisture exposure can affect electrical insulation characteristics and metallic connection points.
- Avoid stacking ESC assemblies. Ceramic structures are strong under designed loads but vulnerable to edge impact and concentrated mechanical stress.
Inspect the chuck face under appropriate lighting before installation.
Do not use abrasive cleaning methods on the ceramic surface. Surface damage can alter wafer contact behavior.
7. Physical Installation Prerequisites
- Install only in the specified Applied Materials process chamber configuration.
- Verify ESC part number compatibility with the chamber revision before replacement.
- Use cleanroom-approved handling procedures.
- Wear appropriate gloves to prevent contamination of the wafer-contact surface.
- Inspect heater connections, mounting surfaces, and electrical contacts before installation.
- Confirm grounding paths between the ESC assembly and chamber structure.
- Maintain chamber cleanliness requirements during installation.
- Avoid impact on ceramic edges and sealing surfaces.
8. Buyer’s FAQ (Logistics & Compliance Focus)
Q: What HS Tariff Code is commonly reviewed for the AMAT 0010-47763?
A: ESC assemblies may be evaluated under HS 8479 (specialized machinery parts) or related semiconductor equipment component classifications depending on customs interpretation. Confirm the final classification with the importing country’s customs authority.
Q: Why does Country of Origin (COO) documentation matter for this ESC assembly?
A: COO supports customs clearance, supplier qualification, and semiconductor equipment maintenance records. The COO should match the commercial invoice, packing list, and part identification documentation.
Q: Is shipping insurance recommended for the AMAT 0010-47763?
A: Yes. The ceramic chuck surface and heater structure are sensitive to impact damage. Use shock protection, clean packaging, moisture control, and declared-value freight coverage.
Q: Does the AMAT 0010-47763 include the latest firmware pre-loaded?
A: No. The ESC assembly contains no processor, memory, or firmware. Temperature control and electrostatic operation are managed by the Applied Materials equipment control system.
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